- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/784 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, each consisting of a single circuit element the substrate being a semiconductor body
Patent holdings for IPC class H01L 21/784
Total number of patents in this class: 125
10-year publication summary
13
|
7
|
13
|
5
|
15
|
9
|
7
|
8
|
21
|
4
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
20 |
Infineon Technologies AG | 8189 |
8 |
Denso Corporation | 23338 |
5 |
Semiconductor Components Industries, L.L.C. | 5345 |
5 |
Toyota Motor Corporation | 28582 |
4 |
Texas Instruments Incorporated | 19376 |
4 |
Infineon Technologies Austria AG | 1954 |
4 |
MIRISE Technologies Corporation | 190 |
4 |
Samsung Electronics Co., Ltd. | 131630 |
3 |
Toshiba Corporation | 12017 |
3 |
Intel Corporation | 45621 |
3 |
United Microelectronics Corp. | 3921 |
3 |
Rohm Co., Ltd. | 5843 |
3 |
Hamamatsu Photonics K.K. | 4161 |
3 |
Disco Corporation | 1745 |
3 |
STATS ChipPAC Pte. Lte. | 1516 |
3 |
Xintec Inc. | 265 |
3 |
Toshiba Electronic Devices & Storage Corporation | 1602 |
3 |
Murata Manufacturing Co., Ltd. | 22355 |
2 |
Epistar Corporation | 1553 |
2 |
Other owners | 37 |